ASUS TUF Gaming FX507ZI4-LP031 RAM upgrade specifications
The ASUS TUF Gaming F15 FX507ZI4-LP031 features DDR4-SDRAM memory with two SO-DIMM slots supporting upgrades to a maximum of 32 GB total capacity. The memory operates at 3200 MHz frequency. Compatible RAM upgrades utilize SO-DIMM form factor modules, enabling users to expand the laptop's memory configuration beyond factory specifications for enhanced multitasking and gaming performance.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
Additional Notes
- The dual-channel architecture requires installing matched pairs of modules to achieve maximum memory bandwidth and prevent system latency during heavy gaming workloads.
- Upgrading the ASUS TUF Gaming FX507ZI4-LP031 involves the removal of the bottom chassis panel which exposes internal components to potential electrostatic discharge risks.
- The 32 GB ceiling indicates that the motherboard firmware will not address high-density 32 GB single sticks, effectively limiting expansion to 16 GB per slot.
- Installing modules with frequencies higher than 3200 MHz will result in automatic downclocking to match the hard-coded limits of the integrated memory controller.
- Using 1.2V low-voltage modules is necessary to maintain thermal efficiency and ensure compatibility with the existing power delivery system on the motherboard.
- The physical SO-DIMM design prevents the installation of desktop-class DIMM memory due to different pin counts and physical length requirements.
- Manual configuration of XMP profiles is typically unavailable in this hardware category, making Plug N Play JEDEC timing compliance essential for achieving the rated speed.
- Replacement of factory-installed memory may require careful handling of thermal pads or shields to ensure heat dissipation for the new modules remains within safe operating parameters.