ASUS Vivobook J412FA-EC016T RAM upgrade specifications
ASUS Vivobook Flip J412FA-EC016T laptop memory upgrade specifications indicate DDR4-SDRAM compatibility with one SO-DIMM slot available for expansion. The device features on-board memory combined with a single upgradeable SO-DIMM slot, supporting maximum RAM capacity of 12 GB at 2400 MHz frequency. Compatible memory modules must meet DDR4-SDRAM specifications for proper functionality with this Vivobook Flip series model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2400 MHz |
| Maximum RAM | 12 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2400 (PC4-19200) |
| Bandwidth | 19.2 GB/s |
| Laptop Release date | 06 August 2019 |
Additional Notes
- The presence of on board memory indicates that a portion of the system RAM is permanently soldered to the motherboard and cannot be replaced or upgraded.
- The ASUS J412FA-EC016T architecture employs a single expansion slot which limits memory configurations to an asymmetric dual channel mode if the inserted module capacity differs from the fixed on board amount.
- System bandwidth is restricted by the 2400 MHz frequency ceiling and any higher speed modules installed will automatically downclock to match the hardware controller limit.
- Reaching the 12 GB maximum threshold requires a specific 8 GB module installation to supplement a 4 GB soldered base and exceeding this limit may result in a failure to boot or unrecognized capacity.
- Internal access for the SO-DIMM slot requires removing the entire lower chassis cover which may involve standard cross head screws and plastic clips but provides no external access hatch.
- Thermal constraints usually associate with this form factor suggesting that high performance memory modules with thick heat spreaders might interfere with the internal clearance of the casing.
- Latency timings will synchronize with the soldered memory chips to ensure stability which might prevent the utilization of low CAS latency profiles on aftermarket modules.