ASUS Vivobook J412FA-EC016T RAM upgrade specifications

ASUS J412FA-EC016T ASUS J412FA-EC016T ASUS J412FA-EC016T ASUS J412FA-EC016T ASUS J412FA-EC016T

ASUS Vivobook Flip J412FA-EC016T laptop memory upgrade specifications indicate DDR4-SDRAM compatibility with one SO-DIMM slot available for expansion. The device features on-board memory combined with a single upgradeable SO-DIMM slot, supporting maximum RAM capacity of 12 GB at 2400 MHz frequency. Compatible memory modules must meet DDR4-SDRAM specifications for proper functionality with this Vivobook Flip series model.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM12 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date06 August 2019

Additional Notes

  • The presence of on board memory indicates that a portion of the system RAM is permanently soldered to the motherboard and cannot be replaced or upgraded.
  • The ASUS J412FA-EC016T architecture employs a single expansion slot which limits memory configurations to an asymmetric dual channel mode if the inserted module capacity differs from the fixed on board amount.
  • System bandwidth is restricted by the 2400 MHz frequency ceiling and any higher speed modules installed will automatically downclock to match the hardware controller limit.
  • Reaching the 12 GB maximum threshold requires a specific 8 GB module installation to supplement a 4 GB soldered base and exceeding this limit may result in a failure to boot or unrecognized capacity.
  • Internal access for the SO-DIMM slot requires removing the entire lower chassis cover which may involve standard cross head screws and plastic clips but provides no external access hatch.
  • Thermal constraints usually associate with this form factor suggesting that high performance memory modules with thick heat spreaders might interfere with the internal clearance of the casing.
  • Latency timings will synchronize with the soldered memory chips to ensure stability which might prevent the utilization of low CAS latency profiles on aftermarket modules.