DELL Inspiron 3558 RAM upgrade specifications
The Dell Inspiron 3000 Series 3558 laptop features two SO-DIMM memory slots supporting DDR3L-SDRAM technology at 1600 MHz frequency. Maximum RAM capacity reaches 8 GB for this model. Compatible memory upgrades must utilize SO-DIMM form factor specifications. Current configurations can be expanded by replacing or adding DDR3L-SDRAM modules to achieve maximum supported capacity. Memory specifications are fixed at DDR3L-SDRAM 1600 MHz for compatibility with the 3558 motherboard architecture.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR3L-SDRAM |
| Frequency | 1600 MHz |
| Maximum RAM | 8 GB |
| Voltage | 1.35V (Low Voltage) |
| Number of pins | 204-pin |
| Interface | PC3L |
| PC Speed Rating | PC3L-1600 (PC3L-12800) |
| Bandwidth | 12.8 GB/s |
| Laptop Release date | 11 February 2019 |
Additional Notes
- The motherboard architectural limit restricts memory expansion to 4 GB per slot, preventing the use of higher density 8 GB modules.
- The system requires low voltage 1.35V modules to ensure hardware compatibility and avoid power delivery failures associated with standard 1.5V memory.
- Utilizing both SO DIMM slots enables dual channel memory architecture, which optimizes integrated graphics performance and data throughput compared to a single module configuration.
- Memory modules with a frequency higher than 1600 MHz will undergo automatic downclocking to match the native bus speed of the DELL Inspiron 3558 chipset.
- The maximum supported capacity is sufficient for basic multitasking and web browsing but serves as a primary bottleneck for modern virtualization or professional video editing tasks.
- Physical installation requires the removal of the bottom chassis panel, which grants direct access to the stacked or side by side slot layout without disconnecting the main battery.
- The use of DDR3L SDRAM ensures lower thermal output within the chassis compared to legacy DDR3 technology, extending the lifespan of internal solder joints.