FUJITSU LIFEBOOK A555/G RAM upgrade specifications

FUJITSU A555/G FUJITSU A555/G FUJITSU A555/G FUJITSU A555/G FUJITSU A555/G

The FUJITSU LIFEBOOK A Series A555/G laptop features DDR4-SDRAM memory upgrade specifications with four SO-DIMM slots supporting maximum capacity of 32 GB. Compatible RAM operates at 2133 MHz frequency. Upgrade specifications indicate the A555/G model accommodates SO-DIMM memory modules, allowing users to expand system memory through available slot configuration. Maximum RAM capacity of 32 GB represents the upper limit for memory expansion on the LIFEBOOK A555/G platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots4x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date30 May 2017

Additional Notes

  • The FUJITSU LIFEBOOK A555/G accepts non-ECC unbuffered modules only, as registered or ECC memory types will trigger POST failures or system instability.
  • Four physical slots enable dual-channel operation when populated in matching pairs across channels, effectively doubling memory bandwidth from approximately 17 GB/s to 34 GB/s per channel.
  • Maximum capacity per slot reaches 8 GB, requiring density-specific chips that may not be available in all latency grades or from all manufacturers.
  • DDR4-2133 represents PC4-17000 standard with CAS latencies typically ranging from CL15 to CL17, where tighter timings reduce access delays in memory-intensive applications.
  • SO-DIMM physical dimensions measure 67.6 mm in length versus 133.35 mm for standard DIMMs, preventing installation of desktop memory modules.
  • Mixed module capacities across slots will force all memory to operate at the speed and timings of the slowest installed module.
  • Operating voltage for DDR4-2133 modules is standardized at 1.2V, whereas DDR3L modules at 1.35V are physically incompatible despite similar SO-DIMM form factors.
  • Single-rank versus dual-rank module architecture affects population rules, as four dual-rank modules may reduce maximum supported frequency or prevent POST completion.
  • Bottom-side memory slots often require complete disassembly including keyboard and palmrest removal, voiding seals that indicate warranty-protected component access.
  • Mixing modules from different manufacturers introduces timing inconsistencies that BIOS may resolve through conservative fallback settings, reducing effective performance below rated specifications.
  • The 32 GB maximum assumes BIOS microcode support for 8 GB module density, which may require firmware updates on early production units.