FUJITSU LIFEBOOK U747 RAM upgrade specifications
The FUJITSU LIFEBOOK U Series Model U747 supports memory upgrades utilizing DDR4-SDRAM specifications. The laptop contains 2x SO-DIMM slots for RAM expansion, accommodating a maximum capacity of 32 GB total memory. Compatible memory modules operate at 2133 MHz frequency and utilize the SO-DIMM form factor. Upgrade specifications enable users to expand the existing memory configuration by installing compatible DDR4-SDRAM modules in the available slots to reach the maximum supported capacity of 32 GB.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2133 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2133 (PC4-17064) |
| Bandwidth | 17.1 GB/s |
| Laptop Release date | 10 August 2017 |
Additional Notes
- The 2133 MHz frequency represents DDR4-2133 standard, which operates at PC4-17000 bandwidth delivering 17.06 GB/s theoretical maximum throughput per module.
- Higher frequency modules rated at 2400 MHz or 2666 MHz will downclock to 2133 MHz when installed due to chipset or processor memory controller limitations.
- Dual-channel configuration requires matched pairs of identical capacity modules installed in both slots to achieve combined bandwidth of approximately 34.1 GB/s.
- Single-channel operation occurs when only one slot is populated, reducing memory bandwidth by approximately 50% and potentially impacting integrated graphics performance.
- The 32 GB maximum capacity constraint indicates compatibility with 16 GB SO-DIMM modules, as 2 slots multiplied by 16 GB equals the stated limit.
- SO-DIMM modules measure 67.6 mm in length compared to 133.35 mm desktop DIMM modules, making standard desktop memory physically incompatible.
- DDR4 SO-DIMM operates at 1.2V compared to 1.5V for DDR3, preventing backward compatibility and potential hardware damage if incorrect generation is installed.
- Access to memory slots typically requires bottom panel removal, which may void warranty if security seals are present or if disassembly is explicitly prohibited by manufacturer warranty terms.
- Mixed capacity configurations such as 8 GB plus 16 GB are supported but may result in asymmetric dual-channel mode where only the matched portion operates in dual-channel.
- Non-ECC unbuffered modules are required for consumer laptop platforms, as registered or ECC memory types introduce incompatibility with standard mobile chipsets.
- CAS latency specifications between CL15 and CL17 are typical for DDR4-2133, with lower latency values providing marginally reduced access times measured in nanoseconds.
- Operating temperature range for SO-DIMM modules typically spans 0°C to 85°C, relevant for sustained high-performance workloads in thermally constrained laptop chassis.