LENOVO ThinkPad L560 RAM upgrade specifications
The Lenovo ThinkPad L560 features two SO-DIMM slots for memory expansion with DDR3L-SDRAM type specifications. Maximum supported RAM capacity reaches 16 GB total, operating at 1600 MHz frequency. Compatible memory upgrades utilize SO-DIMM form factor modules. Specifications indicate the laptop supports dual-channel memory configuration, enabling performance-oriented configurations through compatible RAM upgrade options within the specified maximum capacity constraints.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR3L-SDRAM |
| Frequency | 1600 MHz |
| Maximum RAM | 16 GB |
| Voltage | 1.35V (Low Voltage) |
| Number of pins | 204-pin |
| Interface | PC3L |
| PC Speed Rating | PC3L-1600 (PC3L-12800) |
| Bandwidth | 12.8 GB/s |
| Laptop Release date | 03 September 2017 |
Additional Notes
- The motherboard architecture restricts total capacity to 16 GB, precluding the use of 16 GB high-density single modules and requiring a dual 8 GB configuration for maximum memory ceiling.
- The system requires low voltage 1.35V modules, as standard 1.5V DDR3 hardware will cause power delivery failure or prevented boot cycles.
- Utilizing both SO-DIMM slots enables dual-channel memory interleaving, which significantly improves integrated graphics performance compared to a single-channel setup.
- Installation of memory modules with frequencies higher than 1600 MHz will result in automatic downclocking to match the hardware-coded frequency limits of the chipset.
- The physical SO-DIMM form factor is incompatible with desktop DIMM slots or newer DDR4/DDR5 sockets due to varying pin counts and notch positioning.
- Accessing the internal memory slots requires removal of the bottom chassis cover, which allows for hardware maintenance without voiding the standard manufacturer warranty provided no physical damage occurs during the process.
- Latency performance is governed by the 1600 MHz bus speed, meaning modules with lower CAS latency ratings offer the only viable path for reducing memory-related processing delays.