MSI Creator A10SDT-213FR RAM upgrade specifications

MSI A10SDT-213FR MSI A10SDT-213FR MSI A10SDT-213FR MSI A10SDT-213FR MSI A10SDT-213FR

MSI Creator Series 15 model A10SDT-213FR supports DDR4-SDRAM memory upgrades across 2x SO-DIMM slots. Maximum RAM capacity reaches 64 GB with compatible DDR4 modules operating at 2666 MHz frequency. Specifications indicate SO-DIMM form factor for memory upgrade compatibility. Current upgrade slots accommodate standard laptop memory specifications for the Creator 15 series configuration.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date13 October 2020

Additional Notes

  • The MSI Creator A10SDT-213FR requires SO-DIMM modules, which eliminates compatibility with standard DIMM memory intended for desktop systems.
  • DDR4-SDRAM specification restricts backward compatibility with DDR3 modules and forward compatibility with DDR5 technology due to physical notch positioning and voltage differences.
  • The 2666 MHz frequency represents the JEDEC standard baseline, though modules rated at higher speeds will downclock to this frequency when installed, wasting their performance overhead.
  • The 64 GB maximum capacity constraint requires 2 modules of 32 GB each to reach full potential, as single 64 GB SO-DIMM modules exceed the memory controller's per-slot addressing capability.
  • Dual-channel architecture necessitates matched pairs of identical specification modules to achieve symmetric memory bandwidth of 42.6 GB/s per channel.
  • Mixing modules with different densities or timings forces the memory controller to operate at the lowest common denominator, degrading overall system performance.
  • Non-ECC unbuffered modules are required, as the mobile platform's memory controller lacks error correction circuitry and registered DIMM support.
  • Operating voltage must conform to the DDR4 standard of 1.2V, as modules requiring 1.35V or higher may trigger thermal throttling or cause POST failures.
  • CAS latency specifications become critical when upgrading, as higher latency modules at the same frequency increase memory access delays that affect CPU-intensive workloads.
  • Physical clearance between SO-DIMM slots and heat dissipation components may restrict modules with oversized heat spreaders from proper seating.
  • Manufacturer-approved memory configurations ensure warranty coverage, while third-party modules of equivalent specification may void support agreements despite technical compatibility.