MSI Creator 15M A9SD-037 RAM upgrade specifications

MSI 15M A9SD-037 MSI 15M A9SD-037 MSI 15M A9SD-037 MSI 15M A9SD-037 MSI 15M A9SD-037

The MSI Creator 15M A9SD-037 laptop features two SO-DIMM memory slots supporting DDR4-SDRAM upgrade configurations. Maximum compatible RAM capacity reaches 64 GB total, with operating frequency of 2666 MHz. Memory specifications for this model support standard SO-DIMM form factor modules. Upgrade options accommodate expansion from baseline memory to maximum supported capacity through utilization of available slot configurations.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date16 March 2020

Additional Notes

  • The MSI Creator 15M A9SD-037 supports DDR4-3200 modules despite native 2666 MHz specification, provided BIOS settings enable XMP/DOCP profiles for Intel or AMD platforms respectively.
  • SO-DIMM slot configuration limits upgrade scalability to 64 GB total capacity, creating a ceiling incompatible with workloads requiring 128 GB or higher memory configurations common in professional rendering and simulation tasks.
  • Dual-slot architecture requires simultaneous replacement of both modules to reach maximum capacity; single-module upgrades leave one slot dormant and prevent dual-channel operation benefits on the secondary DIMM.
  • DDR4 supply chain maturation indicates warranty-safe sourcing for upgrade modules remains viable through 2025, though DDR5 transition means long-term replacement stock availability will decline after 2026.
  • 2666 MHz baseline frequency represents performance headroom loss relative to 3200 MHz DDR4 standards, resulting in 5 to 12 percent bandwidth reduction during memory-intensive GPU acceleration workflows common in content creation applications.
  • SO-DIMM form factor mandates clearance verification around keyboard deck and internal cable routing; some thermal management modifications may be necessary if heatspreader height exceeds OEM-validated specifications.