MSI Gaming GF63 10SCSR-027IT Thin RAM upgrade specifications

MSI GF63 10SCSR-027IT Thin MSI GF63 10SCSR-027IT Thin MSI GF63 10SCSR-027IT Thin MSI GF63 10SCSR-027IT Thin MSI GF63 10SCSR-027IT Thin

The MSI GF63 10SCSR-027IT Thin Gaming series laptop features DDR4-SDRAM memory upgrade specifications with 2x SO-DIMM slots supporting a maximum RAM capacity of 64 GB. Compatible memory modules operate at 2666 MHz frequency utilizing SO-DIMM form factor. The upgrade specifications enable users to expand the laptop's memory capacity for enhanced multitasking and performance capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date16 April 2020

Additional Notes

  • The MSI GF63 10SCSR-027IT Thin uses laptop-class SO-DIMM slots rather than full-size DIMMs, restricting upgrade options to mobile memory modules and preventing use of desktop RAM.
  • Stock frequency of 2666 MHz indicates the system operates below contemporary DDR4 standards; upgrading to faster modules (3200 MHz or higher) will not improve performance unless the BIOS and 10th-generation Intel processor explicitly support JEDEC or XMP profiles at higher speeds, likely resulting in frequency throttling to native 2666 MHz.
  • Two SO-DIMM slots with 64 GB maximum capacity require both slots to be populated with matching 32 GB modules to reach the upper limit; mixed-capacity configurations (e.g., 16 GB + 32 GB) function but may reduce stability or lock performance to the slower module's specifications.
  • Upgrading beyond the original capacity requires removal of existing modules; no slot remains available for additive installation without replacing or removing a current DIMM.
  • SO-DIMM modules occupy minimal physical space beneath the keyboard deck; installation requires partial disassembly of the palm rest area, and tight internal clearances may affect heatspreader height compatibility on third-party modules.
  • Memory timing and latency specifications for 2666 MHz DDR4 modules vary between manufacturers; modules rated for CAS latency 17 or higher may exhibit compatibility flags during POST even though they remain functional at reduced timings.
  • Factory configuration likely uses single-channel or asymmetric dual-channel operation; upgrading to matched pairs enables full dual-channel bandwidth, doubling memory throughput from approximately 21 GB/s to 42 GB/s.