MSI Gaming GL63 9SEK-885XRU RAM upgrade specifications

MSI GL63 9SEK-885XRU MSI GL63 9SEK-885XRU MSI GL63 9SEK-885XRU MSI GL63 9SEK-885XRU MSI GL63 9SEK-885XRU

MSI GL63 9SEK-885XRU gaming laptop RAM upgrade specifications indicate DDR4-SDRAM memory compatibility. The device features 2x SO-DIMM slots supporting maximum capacity of 64 GB total memory. Upgrade specifications require DDR4 modules operating at 2666 MHz frequency. Compatible memory modules utilize SO-DIMM form factor for the GL series gaming platform. Maximum RAM specifications allow for dual-channel configuration supporting up to 32 GB per slot capacity.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date09 July 2019

Additional Notes

  • Dual channel memory architecture requires installing modules in pairs to achieve maximum theoretical memory bandwidth and reduce CPU bottlenecks during gaming workloads.
  • The MSI GL63 9SEK-885XRU utilizes a standard SODIMM form factor which necessitates the use of 260 pin modules rather than full sized desktop DIMMs.
  • Mixing modules with different CAS latencies forces the system to default to the timings of the slowest stick which can impact frame rate stability in CPU intensive titles.
  • Upgrading beyond the factory configuration requires removing the bottom panel which may involve piercing a factory seal sticker depending on regional warranty policies.
  • The 64 GB threshold indicates compatibility with high density 32 GB modules in each slot allowing for heavy multitasking or professional video rendering tasks.
  • Installing memory with frequencies exceeding 2666 MHz results in automatic downclocking to match the internal chipset limitations of the 9th generation Intel platform.
  • Physical access to the memory slots requires a Phillips head screwdriver and non conductive prying tools to avoid shorting sensitive motherboard components during the installation process.