MSI Gaming GL73 8SD RAM upgrade specifications

MSI GL73 8SD MSI GL73 8SD MSI GL73 8SD MSI GL73 8SD MSI GL73 8SD

MSI GL73 8SD Gaming laptop memory upgrade specifications include DDR4-SDRAM compatible modules with SO-DIMM form factor. The system features 2x SO-DIMM slots supporting maximum RAM capacity of 32 GB total. Memory operates at 2666 MHz frequency. Upgrade components must be DDR4-SDRAM modules compatible with SO-DIMM specifications to ensure proper functionality within the GL series Gaming laptop platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date25 May 2019

Additional Notes

  • The MSI GL73 8SD utilizes SO-DIMM modules, which are physically incompatible with standard desktop DIMM RAM, requiring laptop-specific memory purchases.
  • The 2666 MHz frequency represents DDR4-2666 standard, ensuring compatibility with both slower DDR4-2400 modules (which will downclock) and faster DDR4-3200 modules (which will operate at 2666 MHz maximum).
  • The 32 GB maximum capacity imposes a practical limit of 2x16 GB module configuration, as 2x32 GB kits will not be recognized beyond 16 GB per slot.
  • Dual-channel operation requires matched pairs of identical capacity modules, meaning asymmetric configurations like 8 GB plus 16 GB will result in 16 GB running in single-channel mode with degraded memory bandwidth.
  • The Intel 8th generation chipset lacks native support for DDR4 speeds above 2666 MHz, making higher frequency modules a financially inefficient choice despite backward compatibility.
  • SO-DIMM installation typically requires bottom panel removal, which may void warranty seals depending on regional consumer protection laws and manufacturer policies.
  • The 2-slot configuration means capacity upgrades require complete replacement of existing modules rather than simple addition, potentially leaving functional RAM modules without reuse value.
  • Memory voltage is standardized at 1.2V for DDR4 SO-DIMM, but low-voltage variants (1.05V) should be avoided due to potential stability issues with mobile chipsets not explicitly rated for LPDDR4.
  • CAS latency variations (CL19 versus CL22) at 2666 MHz will produce minimal real-world performance differences in gaming workloads, typically under 3 percent frame rate variance.
  • The chipset supports non-ECC unbuffered memory only, making server-grade ECC SO-DIMM modules physically installable but functionally incompatible and undetectable.