MSI Gaming GL73 8SDK-218XRU RAM upgrade specifications

MSI GL73 8SDK-218XRU MSI GL73 8SDK-218XRU MSI GL73 8SDK-218XRU MSI GL73 8SDK-218XRU MSI GL73 8SDK-218XRU

The MSI GL73 8SDK-218XRU gaming laptop features DDR4-SDRAM memory upgrade specifications with 2x SO-DIMM slots supporting maximum capacity of 32 GB RAM. Compatible memory modules operate at 2666 MHz frequency utilizing SO-DIMM form factor. Upgrade specifications for this MSI Gaming GL series model allow expansion from standard configuration to maximum supported memory capacity through two available SO-DIMM slots.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date13 May 2019

Additional Notes

  • The MSI GL73 8SDK-218XRU supports a maximum dual-channel configuration when both SO-DIMM slots are populated with identical modules, enabling peak memory bandwidth of 42.6 GB/s.
  • Single-channel operation occurs when only one slot is occupied, reducing theoretical bandwidth by approximately 50% and potentially limiting performance in memory-intensive applications and games.
  • The 32 GB ceiling requires 2 modules of 16 GB each, as the chipset does not recognize higher-density single modules.
  • DDR4-2666 represents the highest officially supported frequency; modules rated at 3000 MHz or 3200 MHz will downclock to 2666 MHz when installed.
  • Non-standard voltages above 1.2V may trigger BIOS compatibility issues or prevent POST completion, limiting compatibility to JEDEC-spec modules.
  • SO-DIMM form factor precludes the use of desktop DIMM modules, which are physically incompatible with the 260-pin slot configuration.
  • Access to memory slots on this chassis typically requires bottom panel removal, which may void warranty seals depending on regional service policies.
  • Mixing modules with different CAS latencies forces all installed memory to operate at the slowest timing profile present in the system.
  • ECC SO-DIMMs are incompatible with the mobile chipset in this platform and will either fail to initialize or operate without error correction functionality.
  • Upgrading from single-rank to dual-rank modules at maximum capacity may introduce marginal latency increases measurable only in synthetic benchmarks.