MSI Gaming GL73 8SDK-218XRU RAM upgrade specifications
The MSI GL73 8SDK-218XRU gaming laptop features DDR4-SDRAM memory upgrade specifications with 2x SO-DIMM slots supporting maximum capacity of 32 GB RAM. Compatible memory modules operate at 2666 MHz frequency utilizing SO-DIMM form factor. Upgrade specifications for this MSI Gaming GL series model allow expansion from standard configuration to maximum supported memory capacity through two available SO-DIMM slots.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 13 May 2019 |
Additional Notes
- The MSI GL73 8SDK-218XRU supports a maximum dual-channel configuration when both SO-DIMM slots are populated with identical modules, enabling peak memory bandwidth of 42.6 GB/s.
- Single-channel operation occurs when only one slot is occupied, reducing theoretical bandwidth by approximately 50% and potentially limiting performance in memory-intensive applications and games.
- The 32 GB ceiling requires 2 modules of 16 GB each, as the chipset does not recognize higher-density single modules.
- DDR4-2666 represents the highest officially supported frequency; modules rated at 3000 MHz or 3200 MHz will downclock to 2666 MHz when installed.
- Non-standard voltages above 1.2V may trigger BIOS compatibility issues or prevent POST completion, limiting compatibility to JEDEC-spec modules.
- SO-DIMM form factor precludes the use of desktop DIMM modules, which are physically incompatible with the 260-pin slot configuration.
- Access to memory slots on this chassis typically requires bottom panel removal, which may void warranty seals depending on regional service policies.
- Mixing modules with different CAS latencies forces all installed memory to operate at the slowest timing profile present in the system.
- ECC SO-DIMMs are incompatible with the mobile chipset in this platform and will either fail to initialize or operate without error correction functionality.
- Upgrading from single-rank to dual-rank modules at maximum capacity may introduce marginal latency increases measurable only in synthetic benchmarks.