MSI Gaming GL75 9SD-009NL RAM upgrade specifications

MSI GL75 9SD-009NL MSI GL75 9SD-009NL MSI GL75 9SD-009NL MSI GL75 9SD-009NL MSI GL75 9SD-009NL

MSI GL75 9SD-009NL Gaming series laptop features DDR4-SDRAM memory upgrade specifications. The system contains 2x SO-DIMM slots for RAM expansion, supporting maximum capacity of 64 GB total memory. Compatible upgrades operate at 2666 MHz frequency with SO-DIMM form factor. Specifications enable memory upgrade configurations to enhance performance on Gaming GL series platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date20 August 2019

Additional Notes

  • The MSI GL75 9SD-009NL supports a maximum memory configuration of 32 GB per slot, enabling dual-channel operation when both slots are populated with identical modules.
  • DDR4-2666 represents the highest officially validated frequency for this platform, though some modules rated at higher speeds will downclock automatically to match this limitation.
  • Installing mismatched module capacities or timings will force the system to operate in asymmetric dual-channel mode or revert to single-channel operation, reducing memory bandwidth by approximately 50 percent.
  • SO-DIMM modules measure 67.6 mm in length compared to standard DIMM modules at 133.35 mm, making desktop memory physically incompatible despite identical DDR4 specifications.
  • The 2666 MHz frequency provides 21.3 GB/s theoretical bandwidth per channel, yielding 42.6 GB/s aggregate throughput when both slots operate in dual-channel configuration.
  • Ninth-generation Intel mobile processors paired with this memory specification impose timing constraints, typically requiring CL19 or CL22 latencies rather than desktop-optimized CL16 profiles.
  • Accessing the memory compartment on this chassis requires removing the bottom panel, which may involve disengaging multiple screw types and potentially disconnecting ribbon cables depending on the specific panel design.
  • Non-ECC unbuffered modules represent the only compatible architecture, as registered or ECC memory types will either fail POST or operate without error correction functionality.
  • Voltage specification remains fixed at 1.2V for standard DDR4 SO-DIMM modules, while low-voltage variants at 1.05V may encounter stability issues under sustained workloads.
  • Memory-intensive applications exceeding 64 GB allocation requirements cannot be addressed through upgrade paths on this platform, necessitating external storage caching or workload migration strategies.
  • Temperature operating ranges for SO-DIMM modules typically span 0 to 85 degrees Celsius, though gaming workloads may elevate DIMM temperatures above 70 degrees without additional chassis ventilation modifications.