MSI Gaming GS65 8RE-085IT Stealth Thin RAM upgrade specifications
The MSI GS65 8RE-085IT Stealth Thin gaming laptop features DDR4-SDRAM memory upgrade specifications. The device contains 2x SO-DIMM memory slots with a maximum RAM capacity of 32 GB. Compatible memory modules operate at 2666 MHz frequency and utilize SO-DIMM form factor. Specifications indicate the GS series gaming model supports DDR4 memory upgrades for enhanced system performance and multitasking capability.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 08 January 2019 |
Additional Notes
- Accessing the memory slots requires a full motherboard removal because the chassis utilizes a flipped logic board design.
- The 2666 MHz modules will downclock automatically if paired with lower speed sticks due to JEDEC standardized handshaking.
- Thermal constraints within the thin chassis profile limit the effectiveness of high voltage or overlocked memory modules.
- The absence of soldered memory on the board allows for a true symmetrical dual channel configuration by using 2 identical modules.
- Upgrading to 32 GB involves discarding existing modules since both available physical slots are typically occupied from the factory.
- Applying aftermarket thermal paste to the CPU and GPU is often necessary during a RAM upgrade because the heat pipes must be detached to reach the slots.
- Using 1.2V low voltage modules is required to maintain compatibility with the mobile chipset power delivery system.
- Dual rank modules provide a slight performance benefit in bandwidth heavy tasks compared to single rank alternatives of the same capacity.