MSI Gaming GS65 8RE-085IT Stealth Thin RAM upgrade specifications

MSI GS65 8RE-085IT Stealth Thin MSI GS65 8RE-085IT Stealth Thin MSI GS65 8RE-085IT Stealth Thin MSI GS65 8RE-085IT Stealth Thin MSI GS65 8RE-085IT Stealth Thin

The MSI GS65 8RE-085IT Stealth Thin gaming laptop features DDR4-SDRAM memory upgrade specifications. The device contains 2x SO-DIMM memory slots with a maximum RAM capacity of 32 GB. Compatible memory modules operate at 2666 MHz frequency and utilize SO-DIMM form factor. Specifications indicate the GS series gaming model supports DDR4 memory upgrades for enhanced system performance and multitasking capability.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date08 January 2019

Additional Notes

  • Accessing the memory slots requires a full motherboard removal because the chassis utilizes a flipped logic board design.
  • The 2666 MHz modules will downclock automatically if paired with lower speed sticks due to JEDEC standardized handshaking.
  • Thermal constraints within the thin chassis profile limit the effectiveness of high voltage or overlocked memory modules.
  • The absence of soldered memory on the board allows for a true symmetrical dual channel configuration by using 2 identical modules.
  • Upgrading to 32 GB involves discarding existing modules since both available physical slots are typically occupied from the factory.
  • Applying aftermarket thermal paste to the CPU and GPU is often necessary during a RAM upgrade because the heat pipes must be detached to reach the slots.
  • Using 1.2V low voltage modules is required to maintain compatibility with the mobile chipset power delivery system.
  • Dual rank modules provide a slight performance benefit in bandwidth heavy tasks compared to single rank alternatives of the same capacity.