ASUS ROG G713QM-HX038T RAM upgrade specifications

ASUS G713QM-HX038T ASUS G713QM-HX038T ASUS G713QM-HX038T ASUS G713QM-HX038T ASUS G713QM-HX038T

ASUS ROG Strix G17 G713QM-HX038T laptop memory upgrade specifications. Equipped with DDR4-SDRAM memory operating at 3200 MHz. The system contains 2 SO-DIMM memory slots, supporting maximum capacity of 32 GB RAM. Compatible upgrades utilize SO-DIMM form factor modules. Current memory configuration and maximum capacity specifications enable performance optimization through RAM expansion. Upgrade compatibility limited to DDR4-SDRAM modules meeting frequency specifications.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date25 December 2020

Additional Notes

  • The ASUS ROG G713QM-HX038T accepts only DDR4 modules, precluding any future migration to DDR5 technology without replacing the entire system.
  • The 32 GB ceiling requires each SO-DIMM slot to accommodate a maximum 16 GB module, as the dual-slot configuration cannot support higher-density individual sticks.
  • Memory rated below 3200 MHz will function but operate at its native lower speed, potentially creating bandwidth asymmetry if mixed with properly rated modules.
  • Installing modules faster than 3200 MHz results in automatic downclocking to the system's maximum supported frequency, eliminating any performance benefit from premium-priced high-speed kits.
  • SO-DIMM form factor modules measure 67.6 mm in length compared to standard DIMM's 133.35 mm, making desktop memory physically incompatible regardless of specification matches.
  • Accessing the memory slots typically requires bottom panel removal, which may involve breaking factory seals on units still covered under manufacturer warranty terms.
  • Mixing modules with different latency timings forces the memory controller to adopt the slowest common timing across all installed sticks, degrading overall performance.
  • Single-channel operation using only one populated slot reduces memory bandwidth by approximately 50 percent compared to dual-channel configurations utilizing both slots.
  • The 3200 MHz specification indicates JEDEC standard operation rather than overclocked XMP profiles, ensuring stability without BIOS intervention.
  • Voltage requirements for DDR4-3200 SO-DIMM modules standardize at 1.2V, with higher-voltage modules potentially causing thermal throttling in confined laptop chassis environments.