ASUS ROG G713QM-HX063T RAM upgrade specifications

ASUS G713QM-HX063T ASUS G713QM-HX063T ASUS G713QM-HX063T ASUS G713QM-HX063T ASUS G713QM-HX063T

The ASUS ROG Strix G17 G713QM-HX063T features DDR4-SDRAM memory upgrade capabilities with two SO-DIMM slots supporting maximum capacity of 32 GB RAM. Compatible memory operates at 3200 MHz frequency. Specifications indicate SO-DIMM form factor for memory modules, enabling straightforward upgrade procedures for enhanced system performance on the Strix G17 gaming laptop series.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date28 December 2020

Additional Notes

  • The ASUS ROG G713QM-HX063T utilizes DDR4 technology, which means DDR5 modules are physically and electrically incompatible with the memory controller.
  • The 3200 MHz native frequency suggests pairing modules of identical speed ratings prevents one module from forcing the other to downclock to a lower transfer rate.
  • SO-DIMM form factor indicates standard desktop DIMM modules cannot be installed due to different pin counts and physical dimensions.
  • The 32 GB maximum capacity limitation originates from chipset or memory controller restrictions rather than physical slot availability.
  • Installing a single module instead of matched pairs disables dual-channel operation, reducing memory bandwidth by approximately 50 percent.
  • Mixing modules with different CAS latencies or voltage requirements may cause POST failures or force all modules to operate at the slowest common timings.
  • The 2-slot configuration means upgrading to 32 GB requires replacing existing modules entirely if factory-installed RAM exceeds 16 GB total capacity.
  • Non-standard voltage modules rated outside the DDR4 specification of 1.2V may trigger compatibility issues or require manual BIOS adjustments unavailable in locked firmware.
  • Accessing the memory slots likely requires bottom panel removal, which may void warranty seals depending on regional consumer protection laws.
  • ECC SO-DIMM modules are incompatible unless the AMD Ryzen chipset explicitly supports error-correcting code memory, which consumer-grade platforms typically do not.
  • Exceeding the 3200 MHz specification through XMP profiles depends on whether the BIOS exposes overclocking controls for memory frequency adjustments.