ASUS ROG GL704GW-EV044T RAM upgrade specifications
ASUS ROG Strix GL704GW-EV044T RAM upgrade specifications include DDR4-SDRAM memory with 2x SO-DIMM slots. Maximum memory capacity reaches 32 GB total. Compatible upgrades utilize SO-DIMM form factor operating at 2666 MHz frequency. Existing memory configurations can be expanded by replacing or supplementing installed modules with DDR4 memory meeting specifications. Slot configuration permits dual-channel memory architecture for enhanced performance. Specifications define upgrade parameters for this gaming laptop model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 16 May 2019 |
Additional Notes
- The ASUS ROG GL704GW-EV044T contains 2 SO-DIMM slots operating at 2666 MHz, which means both slots must be populated simultaneously to achieve dual-channel memory bandwidth. Single-slot configurations force single-channel operation, reducing effective memory throughput by approximately 50 percent compared to a dual-channel setup.
- SO-DIMM modules are laptop-specific form factors measuring 67.6 mm in length. Desktop DDR4 UDIMM modules (approximately 133.35 mm) are physically incompatible and cannot be installed regardless of electrical specifications, making vendor compatibility verification essential before purchase.
- The 32 GB maximum capacity ceiling is determined by SO-DIMM architectural limits rather than slot count. Upgrading beyond the current configuration requires replacing existing modules with higher-density units (16 GB per module), not adding additional sticks.
- DDR4-2666 MHz operates below current mainstream DDR4 speeds (3200 MHz standard). Newer DDR4 modules rated for 3200 MHz will downclock to 2666 MHz in this system due to BIOS limitations, eliminating any performance advantage from higher-speed purchases while increasing module cost unnecessarily.
- RAM upgrades on this chassis typically require full palmrest and keyboard removal to access the SO-DIMM compartment. This disassembly depth may void consumer warranties unless performed by authorized service centers, constraining safe upgrade options.
- Mixing memory densities (e.g., 8 GB + 16 GB modules) functions but leaves 8 GB of capacity inaccessible if the system defaults to single-sided addressing on the smaller module, wasting investment in asymmetric configurations.