ASUS TUF Dash FX516PM-HN024 RAM upgrade specifications
The ASUS TUF Dash F15 FX516PM-HN024 laptop features DDR4-SDRAM memory configuration with one SO-DIMM slot available for upgrade. The device supports maximum RAM capacity of 32 GB at 3200 MHz frequency. Memory specifications indicate on-board integrated memory with one upgradeable SO-DIMM slot for compatible RAM modules. Upgrade options allow users to expand memory capacity beyond factory configuration to enhance system performance and multitasking capabilities.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 25 January 2021 |
Additional Notes
- The presence of a single SO-DIMM slot combined with soldered memory creates an asynchronous dual-channel environment if the expansion module capacity does not match the on-board chip density.
- Upgrading the ASUS TUF Dash FX516PM-HN024 beyond the factory configuration requires a 260-pin module to maintain native 3200 MHz frequencies without relying on XMP profiles.
- Total addressable memory remains limited by the hardwired on-board capacity since only one physical socket is available for manual expansion.
- Latency disparities between the fixed system memory and an added module will result in the hardware defaulting to the slowest Common Denominator timings across both banks.
- Replacement of the existing SO-DIMM module does not require specialized soldering tools but access to the internal slot involves removing the entire lower chassis assembly.
- Maximum bandwidth is restricted to the integrated memory controller limits imposed by the CPU architecture even if a module with higher theoretical speeds is installed.
- Thermal dissipation within the compact chassis remains a factor when installing high-density 32 GB modules due to increased proximity to other heat-generating surface-mount components.