ASUS TUF Dash FX516PM-HN024W RAM upgrade specifications
ASUS TUF Dash F15 FX516PM-HN024W supports DDR4-SDRAM memory upgrades with one SO-DIMM slot available for expansion. The laptop features 8GB onboard memory with maximum RAM capacity of 24GB when fully upgraded. Compatible memory modules operate at 3200 MHz frequency. Specifications indicate single upgradeable slot supporting SO-DIMM form factor for memory expansion. Maximum supported memory configuration reaches 24GB total capacity through the available upgrade slot.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 24 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 07 October 2021 |
Additional Notes
- The presence of a single SO-DIMM slot combined with soldered memory creates an asynchronous dual-channel configuration if the expansion module capacity exceeds the on-board allotment.
- System memory scaling is limited by a hardware ceiling of 24 GB because the integrated motherboard memory cannot be removed or replaced.
- The ASUS TUF Dash FX516PM-HN024W utilizes a non-symmetrical memory architecture which may result in a performance drop once the capacity exceeds the synchronized region of the dual-channel bandwidth.
- Memory upgrades must strictly match the 3200 MHz frequency to avoid downclocking the entire system to a lower common denominator speed.
- The soldered memory component acts as a permanent baseline that prevents full module replacement if the integrated chips develop hardware faults.
- Internal access for maintenance requires a screwdriver to remove the bottom chassis plate since the SO-DIMM slot is not accessible through an external door.
- Latency timings on the expansion module should align with the fixed on-board CAS latency to ensure system stability and prevent boot failures.
- Thermal management during high-load tasks relies on the proximity of the expansion slot to the internal cooling pipes which may affect the lifespan of high-density modules.