ASUS TUF Gaming FA808UM-S8013W RAM upgrade specifications

ASUS FA808UM-S8013W ASUS FA808UM-S8013W ASUS FA808UM-S8013W ASUS FA808UM-S8013W ASUS FA808UM-S8013W

ASUS TUF Gaming A18 model FA808UM-S8013W features DDR5-SDRAM memory upgrade capability with two SO-DIMM slots supporting maximum capacity of 64 GB RAM. Compatible memory modules operate at 5600 MHz frequency. Specifications allow for RAM expansion using DDR5 SO-DIMM form factor modules, enabling enhanced system performance and multitasking capacity. Upgrade slots accommodate standard DDR5 memory configurations for this gaming laptop series.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency5600 MHz
Maximum RAM64 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-5600 (PC5-44800)
Bandwidth44.8 GB/s
Laptop Release date19 May 2025

Additional Notes

  • DDR5 modules operate at a higher base voltage of 1.1V compared to DDR4's 1.2V, which contributes to reduced heat generation under sustained gaming loads.
  • The ASUS TUF Gaming FA808UM-S8013W's dual-channel SO-DIMM configuration requires matched pairs for optimal memory interleaving, where mismatched capacity or speed ratings will force the controller to downclock to the lowest common specification.
  • 5600 MHz represents a JEDEC-standard speed for DDR5, ensuring broader compatibility with third-party modules without requiring XMP profile activation.
  • The 64 GB ceiling indicates controller support for 32 GB density modules, which utilize advanced 16Gbit die configurations not available in earlier DDR5 production runs.
  • SO-DIMM installation typically involves a 30-degree insertion angle followed by downward pressure until retention clips engage, with improper seating causing POST failures or single-channel fallback operation.
  • DDR5's on-module power management IC (PMIC) increases per-stick component count, making physical damage during installation more consequential than with DDR4 architectures.
  • Memory bandwidth scales linearly with populated slots, where a single 32 GB module operates at half the theoretical throughput of dual 16 GB sticks despite identical capacity.
  • Thermal considerations become relevant above 4800 MHz, as higher frequency DDR5 modules generate measurably more heat that laptop cooling solutions must dissipate alongside CPU and GPU loads.
  • The standardized 262-pin SO-DIMM interface prevents cross-generation insertion, physically blocking DDR4 modules through altered notch positioning.
  • Warranty preservation typically requires avoiding module configurations exceeding manufacturer-validated specifications, though 64 GB represents the tested maximum rather than a physical limitation.
  • Latency penalties from asynchronous memory speeds occur when mixing modules of different frequencies, as the memory controller enforces the lower speed across both channels.