ASUS TUF Gaming FX506LH-HN004W RAM upgrade specifications

ASUS FX506LH-HN004W ASUS FX506LH-HN004W ASUS FX506LH-HN004W ASUS FX506LH-HN004W ASUS FX506LH-HN004W

ASUS TUF Gaming F15 series FX506LH-HN004W features DDR4-SDRAM memory upgrade specifications. Laptop includes 2x SO-DIMM slots for RAM expansion with maximum capacity of 32 GB compatible memory. Supported memory frequency operates at 2933 MHz. SO-DIMM form factor specifications define upgrade compatibility for this model. Maximum RAM configuration supports up to 32 GB total capacity across available slots.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2933 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2933 (PC4-23464)
Bandwidth23.5 GB/s
Laptop Release date19 March 2022

Additional Notes

  • The presence of 2 physical SO-DIMM slots signifies that maximum memory capacity is achieved by replacing existing modules rather than adding to a soldered base.
  • Utilizing a matched pair of modules enables dual-channel memory architecture, which increases memory bandwidth and reduces CPU bottlenecks during heavy gaming or rendering tasks.
  • The 2933 MHz frequency ceiling indicates that installing higher-speed modules will result in the memory down-clocking to match the system bus limitations.
  • Accessing the memory slots on the ASUS TUF Gaming FX506LH-HN004W requires a standard Phillips screwdriver and the careful removal of the bottom chassis cover, which contains varying screw lengths.
  • Upgrading to the 32 GB limit provides the necessary overhead for complex multitasking and high-resolution video editing without relying on slower virtual memory paging on the storage drive.
  • Low-voltage 1.2V DDR4 modules are required to ensure thermal efficiency and compatibility with the existing power delivery system on the motherboard.
  • Warranty coverage remains intact during a RAM swap provided no physical damage occurs to the internal headers or adjacent components during the installation process.