ASUS TUF Gaming FX507ZM-HQ113W RAM upgrade specifications

ASUS FX507ZM-HQ113W ASUS FX507ZM-HQ113W ASUS FX507ZM-HQ113W ASUS FX507ZM-HQ113W ASUS FX507ZM-HQ113W

ASUS TUF Gaming F15 FX507ZM-HQ113W laptop features two SO-DIMM slots supporting DDR5-SDRAM memory upgrades. Maximum compatible RAM capacity reaches 32 GB total. Memory specifications include DDR5-4800 MHz frequency support. Upgrade slots accommodate SO-DIMM form factor modules. Existing memory configuration allows for single or dual-module installation to achieve maximum specifications.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM32 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s
Laptop Release date20 April 2022

Additional Notes

  • The presence of 2 SO-DIMM slots confirms that the ASUS FX507ZM-HQ113W utilizes a non-soldered configuration, allowing for the complete replacement of existing modules rather than relying on fixed onboard memory.
  • Operating on the DDR5 standard provides increased memory bandwidth and lower power consumption compared to older DDR4 architectures, though it requires specific 262-pin hardware and is not backward compatible.
  • Reaching the 32 GB threshold suggests the motherboard firmware or chipset imposes a ceiling that prevents the utilization of 32 GB individual sticks for a 64 GB total capacity.
  • Dual-channel mode functionality depends on installing 2 identical modules, which significantly enhances integrated processing speeds and reduces data latency during heavy workloads.
  • The 4800 MHz clock speed indicates a high-frequency baseline that minimizes data transfer bottlenecks between the central processor and the system memory.
  • Physical access to the memory slots typically involves removing the bottom chassis panel, which requires careful handling of internal ribbon cables and static discharge protection to maintain hardware integrity.
  • Internal space restrictions within the laptop chassis generally limit memory upgrades to standard height modules, making oversized heat spreaders incompatible with the casing.