HP Elitebook Revolve 810 G1 RAM upgrade specifications

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HP Elitebook Revolve 810 G1 supports memory upgrades via one SO-DIMM slot. Maximum RAM capacity is 12 GB using DDR3-SDRAM modules operating at 1600 MHz. Upgrade specifications indicate compatible memory modules must meet SO-DIMM form factor requirements. The laptop features hybrid memory configuration with on-board memory combined with one accessible SO-DIMM slot for expansion.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR3-SDRAM
Frequency1600 MHz
Maximum RAM12 GB
Voltage1.5V
Number of pins204-pin
InterfacePC3
PC Speed RatingPC3-1600 (PC3-12800)
Bandwidth12.8 GB/s
Laptop Release date01 April 2013

Additional Notes

  • The HP Elitebook Revolve 810 G1 employs a hybrid memory architecture with permanently soldered RAM on the motherboard alongside a single SO-DIMM slot, preventing complete memory replacement and limiting upgrade flexibility.
  • The 12 GB maximum capacity indicates 4 GB soldered memory paired with an 8 GB module limit, creating an asymmetric dual-channel configuration that may reduce theoretical bandwidth efficiency compared to matched capacity pairs.
  • DDR3-1600 operates at a peak theoretical bandwidth of 12.8 GB/s per channel, though the hybrid configuration and potential single-channel fallback in certain operations constrains sustained memory throughput.
  • SO-DIMM modules must match the onboard 1600 MHz specification to maintain synchronous operation, as mixing frequencies forces the memory controller to downclock faster modules to the lowest common speed.
  • The soldered component eliminates the possibility of troubleshooting faulty onboard memory through replacement, requiring motherboard-level service if that portion fails.
  • Single slot availability requires immediate selection of the highest desired capacity module, as incremental upgrades necessitate discarding and replacing the existing SO-DIMM rather than adding alongside it.
  • Low-voltage DDR3L modules rated at 1.35V may offer compatibility, though verifying manufacturer specifications prevents potential stability issues from voltage mismatches with the soldered component.
  • The physical SO-DIMM installation typically requires bottom panel removal in ultraportable chassis designs, which may involve multiple screw types and ribbon cable navigation in compact internal layouts.