LENOVO ThinkPad P15s (Gen 2) RAM upgrade specifications

LENOVO P15s (Gen 2) LENOVO P15s (Gen 2) LENOVO P15s (Gen 2) LENOVO P15s (Gen 2) LENOVO P15s (Gen 2)

Lenovo ThinkPad P Series P15s (Gen 2) features DDR4-SDRAM memory upgrade specifications with one SO-DIMM slot available for expansion. The mobile workstation supports maximum RAM capacity of 48 GB total, combining on-board memory with upgradeable SO-DIMM modules. Compatible memory operates at 3200 MHz frequency. The upgrade specifications enable users to expand system memory capacity beyond factory-installed configurations by installing compatible DDR4 modules into the available expansion slot.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM48 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s

Additional Notes

  • The presence of on board memory indicates that the total system bandwidth operates in dual channel mode only when the capacity of the added module matches the soldered capacity.
  • Systems featuring the Lenovo ThinkPad P15s Gen 2 architecture lose dual channel performance advantages for any memory volume exceeding the matched soldered amount.
  • Installation of a single expansion module limits the hardware to a 1 slot physical upgrade path which necessitates replacing rather than adding to existing removable sticks.
  • Thermal constraints within the slim chassis may cause the high density 48 GB configuration to throttle during sustained memory intensive professional rendering tasks.
  • The 3200 MHz frequency provides a hard ceiling for data transfer rates as the motherboard firmware will downclock faster aftermarket modules to match the soldered memory speed.
  • Latencies are governed by the weakest link between the integrated chips and the removable SO-DIMM which can result in increased timing cycles if non parity modules are mixed.
  • Internal access for hardware maintenance requires the removal of the entire base panel which involves plastic clips prone to fatigue during frequent opening.
  • Total addressable memory is restricted by the soldered base layer meaning the maximum 48 GB ceiling is only achievable with a specific 32 GB module pairing.