MSI Gaming GF63 10SCXR-045FR Thin RAM upgrade specifications

MSI GF63 10SCXR-045FR Thin MSI GF63 10SCXR-045FR Thin MSI GF63 10SCXR-045FR Thin MSI GF63 10SCXR-045FR Thin

The MSI GF63 10SCXR-045FR Thin gaming laptop features DDR4-SDRAM memory upgrade capabilities. The device contains 2x SO-DIMM slots for RAM installation, supporting a maximum capacity of 64 GB total memory. Compatible memory modules operate at 2666 MHz frequency and utilize the SO-DIMM form factor. Specifications enable users to upgrade the existing memory configuration by replacing or adding DDR4-SDRAM modules to enhance system performance and multitasking capabilities on the MSI Gaming GF series laptop.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date10 April 2020

Additional Notes

  • The MSI GF63 10SCXR-045FR Thin supports DDR4 SO-DIMM modules running at 2666 MHz, which corresponds to PC4-21300 in module nomenclature when calculating bandwidth requirements.
  • Both memory slots accept dual-rank modules up to 32 GB each, enabling the 64 GB maximum configuration without requiring future-generation high-density chips.
  • Installing a single module will disable dual-channel operation, cutting memory bandwidth to approximately 21 GB/s instead of the 42 GB/s available with matched pairs.
  • Modules rated above 2666 MHz will downclock to this frequency due to chipset limitations, making premium high-speed kits functionally identical to standard-speed versions in this system.
  • The SO-DIMM form factor requires notebook-specific modules measuring 67.6 mm in length, as standard desktop DIMM modules at 133.35 mm will not physically fit the slots.
  • Mixing modules with different CAS latencies may force both to operate at the slower timing specification, potentially increasing memory access delays by several nanoseconds.
  • Accessing the SO-DIMM slots typically requires removing the bottom panel, which involves unscrewing multiple fasteners and may expose other components to static discharge risk without proper grounding.
  • Voltage specification must remain at 1.2V for DDR4 compatibility, as higher-voltage modules designed for overclocking could trigger stability issues or prevent POST completion.
  • The Intel 10th generation platform underlying this configuration does not officially support DDR4 speeds beyond 2933 MHz, making the 2666 MHz specification a conservative choice within JEDEC standards.
  • Upgrading from the factory configuration requires verifying whether existing modules are single or dual-rank, as mixing rank configurations can cause compatibility issues on some chipsets.