MSI Gaming GF63 Thin 10SCXR-686FR RAM upgrade specifications

MSI GF63 Thin 10SCXR-686FR MSI GF63 Thin 10SCXR-686FR MSI GF63 Thin 10SCXR-686FR MSI GF63 Thin 10SCXR-686FR MSI GF63 Thin 10SCXR-686FR

The MSI GF63 Thin 10SCXR-686FR gaming laptop features DDR4-SDRAM memory upgrade specifications with two SO-DIMM slots supporting maximum capacity of 64 GB. The system operates at 2666 MHz frequency. Memory upgrade options are compatible with SO-DIMM form factor modules, allowing configuration of the gaming series machine for enhanced RAM capacity up to specified maximum. Specifications indicate dual-slot architecture enabling modular memory expansion for the GF gaming family laptop model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date16 July 2020

Additional Notes

  • The MSI GF63 Thin 10SCXR-686FR accepts DDR4 modules with JEDEC standard voltage of 1.2V, preventing compatibility with older DDR3 or DDR3L modules that operate at different voltage specifications.
  • Both memory slots support dual-channel architecture, requiring matched pairs of modules to achieve maximum memory bandwidth of 42.7 GB/s compared to 21.3 GB/s in single-channel configuration.
  • The 10th generation Intel Core processor supports native DDR4-2933 speeds, but memory frequency remains locked at 2666 MHz through chipset limitations in this model.
  • Installing higher frequency modules rated at 3200 MHz will function but downclock to the supported 2666 MHz base frequency without performance gain.
  • Single-rank modules typically offer better compatibility in maximum capacity configurations, while dual-rank DIMMs may provide marginal performance improvements in bandwidth-intensive applications.
  • The 64 GB maximum capacity requires 2 modules of 32 GB each, utilizing high-density chips that became commercially available after initial product launch.
  • Memory upgrade procedures require access through the bottom panel, which may involve removing multiple screws and potentially voiding certain warranty seals depending on regional service policies.
  • SO-DIMM modules measure 67.6 mm in length compared to 133.35 mm desktop DIMMs, preventing physical installation of standard UDIMM memory.
  • Mixing modules with different CAS latencies will force all installed memory to operate at the slowest timing specification across both channels.
  • The Intel HM470 chipset architecture allocates memory controller functions within the processor die, meaning memory performance characteristics remain consistent regardless of motherboard revision.