MSI Gaming KATANA GF76 11UG-497AU RAM upgrade specifications

MSI KATANA GF76 11UG-497AU MSI KATANA GF76 11UG-497AU MSI KATANA GF76 11UG-497AU MSI KATANA GF76 11UG-497AU MSI KATANA GF76 11UG-497AU

MSI KATANA GF76 11UG-497AU gaming laptop features DDR4-SDRAM memory upgrade capabilities. The system contains 2x SO-DIMM slots supporting maximum RAM capacity of 64 GB. Compatible memory specifications include DDR4 modules operating at 3200 MHz frequency. Upgrade options allow installation of additional or replacement SO-DIMM memory modules to enhance system performance. The GF series gaming platform supports specifications standard to DDR4-SDRAM technology for RAM expansion.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date28 February 2023

Additional Notes

  • Utilizing twin SO-DIMM slots allows the system to operate in a dual-channel configuration which doubles the memory bandwidth compared to single-channel setups.
  • The maximum capacity of 64 GB requires the installation of 2 matched 32 GB modules as the architecture does not support higher density single sticks.
  • Operating at 3200 MHz on the MSI Katana GF76 11UG-497AU ensures optimal synchronization with the processor memory controller to minimize latency bottlenecks during high-load gaming scenarios.
  • Physical installation of memory necessitates bottom panel removal which requires careful handling of the factory seal to maintain warranty compliance in specific regions.
  • Mixing modules with different timings or ranks may result in the system downclocking to the lowest common denominator or failing to POST due to SPD training errors.
  • The DDR4-SDRAM architecture limits future scalability to newer DDR5 standards because the pin configurations and voltage requirements are physically and electrically incompatible.
  • Internal thermal management depends on thin heat spreaders for RAM modules as excessive component height will interfere with the chassis closure or airflow pathways.