MSI Gaming GL73 8SE-014 RAM upgrade specifications

MSI GL73 8SE-014 MSI GL73 8SE-014 MSI GL73 8SE-014 MSI GL73 8SE-014 MSI GL73 8SE-014

The MSI GL73 8SE-014 Gaming series laptop features DDR4-SDRAM memory upgrade specifications. The system contains two SO-DIMM slots supporting a maximum RAM capacity of 32 GB. Memory modules operate at 2666 MHz frequency. Compatible upgrades utilize SO-DIMM form factor DDR4 specifications. Current specifications and maximum capacity information enable users to identify compatible RAM upgrades for expanding the laptop's memory configuration.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date11 March 2019

Additional Notes

  • The MSI GL73 8SE-014 supports dual-channel memory architecture through its 2 SO-DIMM slots, enabling theoretical bandwidth of 42.6 GB/s when both slots are populated with matched modules.
  • The 32 GB ceiling restricts professional workflows involving large datasets, virtual machine environments, or video editing projects that benefit from RAM allocations exceeding this threshold.
  • DDR4-2666 compatibility limits higher-frequency modules to downclocking, preventing native operation of DDR4-3200 or faster RAM without potential stability implications.
  • SO-DIMM form factor restricts installation to notebook-specific modules measuring 67.6 mm in length, precluding use of standard 133.35 mm desktop DIMM modules.
  • Single-rank versus dual-rank module selection impacts effective bandwidth, with dual-rank configurations potentially delivering 5-15% throughput improvements in memory-intensive applications.
  • Populating both memory slots with identical capacity and timing specifications eliminates asymmetric dual-channel mode, which can introduce latency penalties during interleaved memory access.
  • The non-ECC memory architecture prioritizes performance over error correction, making the system unsuitable for mission-critical applications requiring data integrity verification.
  • Access to memory slots typically requires bottom panel removal, with warranty implications varying based on regional consumer protection regulations and manufacturer service policies.
  • JEDEC-standard DDR4-2666 operates at 1.2V, while overclocked or non-standard modules may require voltage adjustments unsupported by mobile platform chipsets.
  • The 2666 MHz frequency represents a CAS latency absolute time of approximately 13.5 nanoseconds when using CL19 modules, compared to 15 nanoseconds at CL20.